领先同行Renesas晶体振荡器的灵活性

领先同行Renesas晶体振荡器的灵活性，多年来，电源模块一直是工程师的绝佳选择。它们的优势一直包括减少电路板空间、缩短上市时间和高一次通过成功率。就时间和空间而言，今天的工程师在各方面都受到挤压。当负载电流增加时，开发周期时间减少，并且不存在可用于供电的空间。这些趋势正在推动功率模块市场的显著增长。电源模块设计的技术进步增加了它们的优势，导致更小的尺寸、易用性和更大的灵活性。也好比小型化的石英晶体振荡器产品具有更大的灵活性，让我们仔细看看电源模块的一些最新创新。

瑞萨开发了RAA210130使用BGA-POP技术(见下图1)。新的12V、30A数字电源模块在这些电流水平下提供了业界最小的尺寸。这项专利技术将除电感之外的所有元件置于一个过模BGA封装中。电感安装在顶部(层叠封装)，便于组装，设计灵活。

图1: BGA-POP数字电源模块

该解决方案的主要特点是:

• 显著减少电路板空间，同时利用瑞萨晶体最新的数字控制器技术实现世界一流的效率(高达96%)和瞬态响应。
• 整个电源解决方案集成在BGA-POP封装中。从而形成一个完整的电源(见下图2 ),简化PCB设计并消除布线误差。工程师可以专注于系统设计的其他部分，因为解决方案是可预测的，并且模块内部的所有寄生效应都已考虑在内。
• 数字接口(PMBUS)支持完全可配置的电源解决方案，而遥测有助于系统了解所有工作和故障条件。该器件还具有预编程的输出电压，以防最终用户不想对模块进行编程。
• 评估板有助于简化原型制作，并允许设计人员利用特定设计的独特工作条件快速评估模块的性能。

图2: RAA210130电源模块电路图

瑞萨还开发了迷你模块技术(见下图3)。在这种情况下，集成电路嵌入在PCB层压板中，电感安装在顶部。电源解决方案封装在包覆成型双列直插式封装中，便于最终客户制造。领先同行Renesas晶体振荡器的灵活性.

主要功能RAA210040模块有:

• 市场上最小尺寸的5V 4A电源模块。
• 完整的电源解决方案集成在3x3 DFN封装中。
• 该模块受到全面保护(OTP、OCP、OVP等)。)和支持快速原型制作的评估板。

总之，越来越多的空间限制迫使供应商创新下一代电源模块。瑞萨开发了两种新技术来以及高精密的OSC晶振应对这一挑战。我们刚刚开始使用这些和其他新的制造技术来扩展下一代电源模块的家族。

Renesas has developed theRAA210130using BGA-POP technology (see figure 1 below). The new 12V, 30A digital power module provides the smallest footprint in the industry at these current levels. The patented technology places all the components except the inductor inside an over-molded BGA package. The inductor is mounted on top (Package-On-Package) allowing easy assembly and design flexibility.

The key features of this solution are:

• Significant reduction in board space while achieving world-class efficiency (up to 96%) and transient response with Renesas’ latest digital controller technology.
• The entire power solution is integrated into a BGA-POP package. Hence creating a complete power supply (see figure 2 below) that simplifies the PCB design and eliminates routing errors. The engineer can focus on other parts of the system design since the solution is predicable and all parasitics have been accounted for inside the module.
• The digital interface (PMBUS) enables a completely configurable power solution while the telemetry helps the system understand all operating and fault conditions. The part also has preprogrammed output voltages in cases where the end user does not want to program the module.
• The evaluation board helps make prototyping easy and allows the designer to rapidly evaluate the module’s performance using a specific design’s unique operating conditions.

The key features of theRAA210040module are:

• Smallest footprint for a 5V, 4A power module on the market.
• The complete power solution is integrated in a 3x3 DFN package.
• The module is fully protected (OTP, OCP, OVP, etc.) and is supported with an evaluation board for fast prototyping.

In summary, increased space constraints are forcing suppliers to innovate the next generation of power modules. Renesas has developed two new technologies to meet this challenge. We are just beginning to expand the family of next-generation power modules using these and other new manufacturing technologies.