FC3BQ晶振,FC3BQBBMF36.0-T3,36MHZ,福克斯3225mm薄型晶振

FC3BQ晶振,FC3BQBBMF36.0-T3,36MHZ,福克斯3225mm薄型晶振,美国FOX晶振,欧美进口晶振,四脚贴片晶振,SMD晶体谐振器,贴片晶振,36MHZ水晶振动子,3225小尺寸晶振,无源晶振,尺寸3.2x2.5mm,频率36MHZ,负载20pF,工作温度-20~+70°C,无铅环保晶振,高品质晶振,低损耗晶振,数码相机晶振,无线局域网晶振,智能音响晶振.

FC3BQ晶振,FC3BQBBMF36.0-T3,36MHZ,福克斯3225mm薄型晶振,美国FOX晶振,欧美进口晶振,四脚贴片晶振,SMD晶体谐振器,贴片晶振,36MHZ水晶振动子,3225小尺寸晶振,无源晶振,尺寸3.2x2.5mm,频率36MHZ,负载20pF,工作温度-20~+70°C,无铅环保晶振,高品质晶振,低损耗晶振,数码相机晶振,无线局域网晶振,智能音响晶振.

FC3BQ晶振,FC3BQBBMF36.0-T3,36MHZ,福克斯3225mm薄型晶振特点:

尺寸3.2x2.5mm贴片晶振类型包装

公差低至±20PPM

稳定性低至±10PPM

FC3BQ晶振,FC3BQBBMF36.0-T3,36MHZ,福克斯3225mm薄型晶振 参数表

STANDARD SPECIFICATIONS
PARAMETERS							MAX (Unless otherwise noted)
Frequency Range							36.000 MHz
Frequency Tolerance @ 25°C							(See options below)
Frequency Stability, ref 25°C Over Operating Temp Range							(See options below)
Temperature Range Operating (TOPR) Storage (TSTG)							(See options below) -55°C ~ +125°C
Shunt Capacitance (CO)							3 pF
Load Capacitance (CL)							(See options below)
Drive Level							100µW
Aging per year (@ 25°C)							±5 PPM
Maximum Soldering Temp / Time							260°C / 10 Seconds
Moisture Sensitivity Level (MSL) per J-STD-033							1
Termination Finish							Ag
Seal Method							Resin
Lead (Pb) Free							YES
RoHS Compliant							YES

FC3BQ晶振,FC3BQBBMF36.0-T3,36MHZ,福克斯3225mm薄型晶振 尺寸图