LVDS差分晶振X1M000231001600适用于无线模块应用晶振
差分晶振是指能够输出差分信号的晶振,输出差分信号使用2种相位彼此完全相反的信号,从而消除了共模噪声,并产生一个更高性能的系统。
爱普生晶振EG-2121CB是一款低抖动表面声波(SAW)振荡器,小体积晶振尺寸5.0x3.2mm,六脚贴片晶振,有源晶振,宽频率范围从100MHz至700MHz,支持LVDS输出差分晶体振荡器。EG-2121CB有源晶振适用于使用2.5V电源电压的应用,具有较低的相位抖动范围从0.1ps到0.27ps(最大值),具有小体积轻薄型,低抖动,低功耗,低相位噪声,低电源电压,低耗能,低损耗,低电平等特点。被广泛应用于5G通讯设备、机顶盒、光端机、安防设备、路由器/交换机、仪器仪表、无线模块,光纤通信,10G以太网及各种频率控制设备上。
LVDS差分晶振X1M000231001600适用于无线模块应用晶振
产品编码 | 型号 | 频率 | 爱普生晶振 | 输出波 | 电源电压 | 工作温度 |
X1M000231000200 | EG-2121CB | 125.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231000300 | EG-2121CB | 200.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231000400 | EG-2121CB | 156.250000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231000500 | EG-2121CB | 402.832000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231000600 | EG-2121CB | 200.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | -20 to 70 °C |
X1M000231000700 | EG-2121CB | 133.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231001000 | EG-2121CB | 500.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231001100 | EG-2121CB | 402.832031MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231001300 | EG-2121CB | 100.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | -5 to 85 °C |
X1M000231001400 | EG-2121CB | 441.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231001500 | EG-2121CB | 625.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | -5 to 85 °C |
X1M000231001600 | EG-2121CB | 156.250000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | -5 to 85 °C |
X1M000231001700 | EG-2121CB | 644.531250MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231001800 | EG-2121CB | 322.265625MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231001900 | EG-2121CB | 233.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231002000 | EG-2121CB | 200.000000MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
X1M000231002100 | EG-2121CB | 644.531250MHz | 5.00x3.20x1.20mm | LVDS | 2.375 to 2.625 V | 0 to 70 °C |
LVDS差分晶振X1M000231001600适用于无线模块应用晶振
差分晶振一般为六脚贴片晶振,工作温度范围-40℃至+85℃,差分晶振的频率相对都比较高,比如从50MHz起可以做到700MHz或者更低和更高频率,且任意频率精确到个位小数点后六位。电源电压能够做到2.5V-3.3V之间。例如:2.25V、2.5V 、3.0V、3.3V、3.6V可任意选择应用。常见的封装尺寸有7050(7.0x5.0mm)、5032(5.0x3.2mm)、3225(3.2x2.5mm),更小封装可达到2520(2.5x2.0mm),常用的输出方式主要有LVPECL和LVDS两种。
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